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Apollo has the capability to assemble through-hole, manual-insertion, chip-on-board, surface mount and mixed technology boards (including BGAs) and specialize in quick turn and prototype jobs. For large volume jobs, our SMT lines make it possible to run 20,000+ components per hour.

Standard assembly is to IPC A-610 Rev E Class II standards, and complies with Class III requirements when requested. Apollo’s experienced inspectors use a variety of microscopic inspection equipment to back our thorough process control and job documentation practices.

Apollo employs SMT Tools BGA-100 Optical Inspection system for BGA components and can rework and repair standard surface mount components.

Apollo has the experience, flexibility and resources to assist your process of prototype to full-scale production and is capable of working from your supplied parts kits or providing a full turn-key assembly, including functional or in-circuit testing. Apollo can also maintain your inventories using our MRP tracking and reporting system.

Surface Mount Technology

Employing state of the art DEK printers, Placement machines and BTU convection air reflow ovens, Apollo achieves industry standards and beyond in the accurate placement of surface mount devices. With many years experience of placing BGA, UBGA, CSP and small profile passives down to and including 0201, the plant offers a cost effective high yield solution to any SMT requirement.

Pin Through Hole
Capabilities to place tape and reeled radial components sizes. Maximum PCB size is 25" x 25". Placement rates reach 5000 pieces per hour with an accuracy of 99% minimizing component loss.
Conventional Leaded Technology.

RoHS Regulations
Apollo continues to provide full lead based processing for exempt category product, whilst also having invested in lead-free equipment and process control.

Selective Wave Solder
Having the Selective Wave soldering machines, Apollo achieves consistent quality and process control when assembling boards having multiple ground and power planes, high-current connectors or A-typical distribution of components.

Conformal Coating
Both dip-coating and vertical spray coating is available. Protecting non conductive dielectric layer that is applied onto the printed circuit board assembly to protect the electronic assembly from damage due to contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments. When coated, it is clearly visible as a clear and shiny material.

Complete Box Build
Complete ’Box Build’ solutions including materials management of all components, electromechanical parts, plastics, casings and print & packaging material


Inspection Methods

AOI Testing
· Checks for solder paste
· Checks for components down to 0201"
· Checks for missing components, offset, incorrect parts, polarity

X-Ray Inspection
X-Ray provides high-resolution inspection of:
· BGAs
· Micro BGAs
· Chip scale packages
· Bare boards

In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by component problems.
· Power-up Test
· Advanced Function Test
· Flash Device Programming
· Functional testing


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